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3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements

Hirmer, Katrin and Casper, Thorben and Schöps, Sebastian and Hofmann, Klaus
Bogenfeld, Eckard (ed.) (2019):
3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements.
In: URSI Kleinheubacher Tagung (KHB 2019), Miltenberg, 23.–25.09.2019, [Online-Edition: https://www.kh2019.de],
[Conference or Workshop Item]

Official URL: https://www.kh2019.de
Item Type: Conference or Workshop Item
Erschienen: 2019
Editors: Bogenfeld, Eckard
Creators: Hirmer, Katrin and Casper, Thorben and Schöps, Sebastian and Hofmann, Klaus
Title: 3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements
Language: English
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute for Accelerator Science and Electromagnetic Fields > Computational Electromagnetics
18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory (from 01.01.2019 renamed Institute for Accelerator Science and Electromagnetic Fields)
18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory (from 01.01.2019 renamed Institute for Accelerator Science and Electromagnetic Fields) > Computational Engineering (from 01.01.2019 renamed Computational Electromagnetics)
18 Department of Electrical Engineering and Information Technology > Institute for Accelerator Science and Electromagnetic Fields
Exzellenzinitiative
Exzellenzinitiative > Graduate Schools
Exzellenzinitiative > Graduate Schools > Graduate School of Computational Engineering (CE)
Event Title: URSI Kleinheubacher Tagung (KHB 2019)
Event Location: Miltenberg
Event Dates: 23.–25.09.2019
Date Deposited: 04 Oct 2019 08:25
Official URL: https://www.kh2019.de
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