TU Darmstadt / ULB / TUbiblio

Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging

Casper, Thorben and Römer, Ulrich and De Gersem, Herbert and Schöps, Sebastian (2018):
Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging.
In: arXiv, [Report]

Item Type: Report
Erschienen: 2018
Creators: Casper, Thorben and Römer, Ulrich and De Gersem, Herbert and Schöps, Sebastian
Title: Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging
Language: German
Series Name: arXiv
Volume: 1809.09034
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute for Accelerator Science and Electromagnetic Fields > Computational Electromagnetics
18 Department of Electrical Engineering and Information Technology > Institute for Accelerator Science and Electromagnetic Fields
Exzellenzinitiative
Exzellenzinitiative > Graduate Schools
Exzellenzinitiative > Graduate Schools > Graduate School of Computational Engineering (CE)
Date Deposited: 20 Jan 2019 15:26
Related URLs:
Export:
Suche nach Titel in: TUfind oder in Google

Optionen (nur für Redakteure)

View Item View Item