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Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging

Casper, Thorben and Römer, Ulrich and De Gersem, Herbert and Schöps, Sebastian :
Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging.
In: arXiv , 1809.09034 .
[Report] , (2018) (Submitted)

Item Type: Report
Erschienen: 2018
Creators: Casper, Thorben and Römer, Ulrich and De Gersem, Herbert and Schöps, Sebastian
Title: Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging
Language: German
Series Name: arXiv
Volume: 1809.09034
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute for Accelerator Science and Electromagnetic Fields > Computational Electromagnetics
18 Department of Electrical Engineering and Information Technology > Institute for Accelerator Science and Electromagnetic Fields
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Exzellenzinitiative > Graduate Schools
Exzellenzinitiative > Graduate Schools > Graduate School of Computational Engineering (CE)
Date Deposited: 20 Jan 2019 15:26
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