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An air stable high temperature adhesive from modified SiBCN precursor synthesized via polymer-derived-ceramic route

Luan, Xin’gang ; Chang, Sen ; Riedel, Ralf ; Cheng, Laifei :
An air stable high temperature adhesive from modified SiBCN precursor synthesized via polymer-derived-ceramic route.
[Online-Edition: https://doi.org/10.1016/j.ceramint.2018.02.045]
In: Ceramics International, 44 (7) S. 8476-8483. ISSN 02728842
[Artikel] , (2018)

Offizielle URL: https://doi.org/10.1016/j.ceramint.2018.02.045

Kurzbeschreibung (Abstract)

The high temperature adhesives are required in most critical applications such as nuclear and aerospace technology. To obtain an adhesive with high temperature bond strength and low synthesis temperature, polysilazane (PSNB) was modified by PBSZ, PSO, nano-Al2O3 additives. Effect of the SiO2 to B2O3 ratio and curing pressure on microstructure and high temperature bond strength has been investigated. After curing and heat-treating at comparatively lower temperatures, the bond strength of the modified adhesive reached up to 12.08 MPa, at room temperature, and, more significantly, retained the strength of 6.65 MPa at 1000 °C. The bond strength of modified adhesive is two-times higher than pure PSNB adhesive at elevated temperature. We demonstrate that optimum level of fluidity and applied pressure should be established in order to attain maximum bond strength. This paper open up avenues for further research in modifying existing adhesives for high temperature applications.

Typ des Eintrags: Artikel
Erschienen: 2018
Autor(en): Luan, Xin’gang ; Chang, Sen ; Riedel, Ralf ; Cheng, Laifei
Titel: An air stable high temperature adhesive from modified SiBCN precursor synthesized via polymer-derived-ceramic route
Sprache: Englisch
Kurzbeschreibung (Abstract):

The high temperature adhesives are required in most critical applications such as nuclear and aerospace technology. To obtain an adhesive with high temperature bond strength and low synthesis temperature, polysilazane (PSNB) was modified by PBSZ, PSO, nano-Al2O3 additives. Effect of the SiO2 to B2O3 ratio and curing pressure on microstructure and high temperature bond strength has been investigated. After curing and heat-treating at comparatively lower temperatures, the bond strength of the modified adhesive reached up to 12.08 MPa, at room temperature, and, more significantly, retained the strength of 6.65 MPa at 1000 °C. The bond strength of modified adhesive is two-times higher than pure PSNB adhesive at elevated temperature. We demonstrate that optimum level of fluidity and applied pressure should be established in order to attain maximum bond strength. This paper open up avenues for further research in modifying existing adhesives for high temperature applications.

Titel der Zeitschrift, Zeitung oder Schriftenreihe: Ceramics International
Band: 44
(Heft-)Nummer: 7
Verlag: Elsevier Science Publishing
Freie Schlagworte: Polysilazane, High temperature adhesive, Low temperature synthesis, Glass phase, Columnar and reticular carriers
Fachbereich(e)/-gebiet(e): 11 Fachbereich Material- und Geowissenschaften
11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft
11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft > Fachgebiet Disperse Feststoffe
Hinterlegungsdatum: 07 Jun 2018 08:07
DOI: 10.1016/j.ceramint.2018.02.045
Offizielle URL: https://doi.org/10.1016/j.ceramint.2018.02.045
Sponsoren: The authors acknowledge the financial supports from the Research Fund of the State Key Laboratory of Solidification Processing (NWPU), China (Grant No. 135-QP-2015), the National Key Research and Development Program of China (No. 2017YFB0703200)., And Fundamental Research Funds for the Central Universities (Grant No. 3102017zy058).
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